Flexible Board

Flexible printed circuit boards (FPCs) are designed to meet the demands of dynamic applications where space is limited and flexibility is required. They are ideal for replacing traditional wiring and connectors in compact or moving electronic assemblies.

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What are the difficulties of Flexible PCBs manufacturing?

  • High-density FPC circuit miniaturization and via diameter miniaturization.
  • The manufacturing process is complicated. In contrast, the production yield is relatively low for Flexible PCBs.
  • High dimensional stability. With the development of high-density FPC circuits, the requirements for material size are more stringent.
  • The life expectancy of high deflection products is increased from 100,000 to 150,000 times, and the requirements for the FPC manufacturing process are also getting higher and higher.
  • The FPC substrate is thin, soft, and easy to deform. It isn’t easy to assemble SMD on the FPC.

Common Structures

  • Single-sided Flex (IPC-6013 Type 1)
    Coverlay (polyimide + adhesive) laminated on an adhesiveless single-sided polyimide core. With or without stiffeners.

  • Double-sided Flex (IPC-6013 Type 2)
    Adhesiveless double-sided FPC core with plated through holes, covered with coverlay on both sides. With or without stiffeners.

  • Multilayer Flex (IPC-6013 Type 3)
    Three or more conductive layers laminated into an adhesiveless construction with plated through holes, with coverlay on both sides. With or without stiffeners. Capability: up to 6 layers.

Technical Specifications

Number of Layers 1 – 6
Technology Highlights Mainly polyimide-based
Ideal for dynamic bending, 3D interconnects, or space-constrained designs
Materials Polyimide, Polyester
Profile Methods Laser cutting, punching, routing
Finished Copper Weights 8 μm – 70 μm
Minimum Track/Gap 0.05 mm / 0.05 mm
FPC Thickness 0.05 mm – 0.80 mm
Maximum Dimensions 250 mm × 610 mm
Surface Finishes OSP
ENIG
Immersion Tin
Electrolytic Gold
NiPdAu, Gold Fingers
Minimum Mechanical Drill 0.10 mm

Flexible PCBs are essential in applications like medical devices, wearables, consumer electronics, and aerospace equipment, where lightweight, space-saving, and durability are critical.