HDI PCBs
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HDI PCBs

HDI (High-Density Interconnect) PCBs are compact, high-performance circuit boards characterized by high wiring density achieved through microvias, blind and buried vias, and advanced layer interconnect technologies. Like traditional multilayer PCBs, HDI boards consist of both inner and outer layers, connected through techniques such as via drilling, in-hole metallization, and laser drilling.

Typically manufactured using build-up (sequential lamination) processes, HDI PCBs vary in complexity:

  • Standard HDI: Single lamination
  • Advanced HDI: Multiple laminations with stacked microvias and laser direct imaging

The more complex the lamination process, the higher the technological level of the board.

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Key Advantages of HDI PCBs

HDI PCBs are especially cost-effective when the layer count exceeds 8, and they offer superior performance compared to traditional multilayer PCBs in high-density applications. Their benefits include:

  • 💰 Reduced cost for high-layer designs

  • 📐 Higher wiring density, allowing smaller board sizes

  • ⚡ Improved electrical performance and signal integrity

  • 🔒 Enhanced reliability through optimized via structures

  • 🔥 Better thermal management

  • 📡 Superior EMI/ESD/RFI control

  • 🧠 Increased design flexibility and efficiency

As electronics evolve toward miniaturization and precision, HDI technology becomes essential in delivering compact form factors without compromising performance.

Applications of HDI PCBs

HDI boards are widely adopted in industries that demand small size, high performance, and dense component integration, including:

Consumer Electronics

HDI PCBs enable compact, lightweight devices such as:

  • Smartphones (largest demand)

  • Digital cameras (DSLRs, action cams)

  • MP3/MP4 players

  • Laptops and tablets

  • Wearables and handhelds

Automotive & Aerospace

Used in lightweight control units, advanced driver-assistance systems (ADAS), flight controllers, and other space-constrained electronics.

Medical Devices

One of the fastest-growing HDI application areas:

  • Enables miniaturized diagnostic tools and implants

  • Supports low power, high-speed signal transmission, and mechanical compatibility with human anatomy

  • Delivers stable performance in mission-critical environments

Why Choose HDI for Your Project?

HDI technology offers the ideal balance of performance, size, cost, and reliability, making it indispensable in today’s high-end PCB designs. Whether you’re building consumer gadgets, automotive control systems, or cutting-edge medical devices, HDI PCBs are your path to smarter, smaller, and more efficient electronic solutions.

Technical Specifications

Number of Layers 4 – 16 layers (standard), up to 22 layers (advanced)
Technology Highlights High-density interconnect boards with finer lines/spaces,
smaller vias and capture pads, and micro-vias in pads
that only penetrate specific layers
HDI Builds 3+N+3, 4+N+4, Any-layer HDI in R&D
Materials FR4 (standard & high performance)
Halogen-free FR4
Rogers
Finished Copper Weights 18 μm – 70 μm
Minimum Track / Gap 0.075 mm / 0.075 mm
PCB Thickness 0.40 mm – 3.20 mm
Maximum Dimensions 610 mm × 450 mm (depends on laser drilling machine)
Surface Finishes OSP
ENIG
Immersion Tin
Immersion Silver
Electrolytic Gold
Gold Fingers
Minimum Mechanical Drill 0.15 mm
Minimum Laser Drill 0.10 mm (standard), 0.075 mm (advanced)