High Frequency PCBs
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High Frequency PCBs

High-Frequency PCBs are specially engineered circuit boards designed to operate at frequencies above 1GHz, enabling fast and reliable signal transmission in advanced electronic systems. These boards are built using low-loss, high-performance materials to ensure minimal signal degradation and superior electromagnetic performance.

Due to their demanding technical requirements, high-frequency PCBs are commonly used in RF (Radio Frequency), microwave, and high-speed communication applications.

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🔶 Key Advantages of High-Frequency PCBs

High-frequency PCBs offer multiple benefits over standard PCBs, particularly in performance-critical applications:

⚡ High Transmission Efficiency

Thanks to their low dielectric constant (Dk) and low dissipation factor (Df), high-frequency PCBs minimize energy loss during signal transmission, making them ideal for inductive heating, wireless communication, and RF applications.

🚀 Faster Signal Propagation

Signal delay is directly affected by the dielectric material surrounding the copper traces. The lower the Dk, the faster the signal travels. High-frequency PCBs use materials like PTFE, Rogers, or Teflon, which ensure minimal propagation delay and support ultra-high-speed signal transmission.

🔄 Design Flexibility

High-frequency PCBs can support localized or distributed heating in specialized applications like precision metal treatment, enabling engineers to target both surface and deep-layer components during operation.

🌡️ High Thermal & Environmental Stability

These PCBs maintain stable electrical performance even in high-humidity and high-temperature environments, making them suitable for use in automotive, aerospace, and outdoor telecom systems.

🔶 Applications of High-Frequency PCBs

High-frequency PCBs are primarily used in fields that demand rapid, stable signal transmission and RF reliability:

● Telecommunications & Wireless

  • 5G base stations

  • Satellite communications

  • Microwave repeaters

  • RF tags & antennas

  • mmWave radar systems

● Automotive Electronics

  • Automotive radar systems (ADAS)

  • In-vehicle GPS and navigation systems

  • Wireless charging modules

● Aerospace & Defense

  • Communication radar systems

  • Satellite payload components

  • Signal processing and radar imaging

🔶 Technical Specifications

Quality Grade IPC Class 2, IPC Class 3
Number of Layers 2 – 24 layers
Material RO3003, RO3010, RO4003C, RO4350B, RT5880
Maximum Board Size 450 mm × 600 mm
Final Board Thickness 0.4 mm – 5.0 mm
Copper Thickness 0.5 oz – 2.0 oz
Minimum Tracing / Spacing 2 mil / 2 mil
Minimum Drilling Hole Diameter 6 mil (≈0.15 mm)
Solder Mask Color Options Green, Matte Green, Yellow, White, Blue, Purple, Black, Matte Black, Red
Silkscreen Color Options White, Black
Surface Treatments ENIG, OSP, Hard Gold, Immersion Silver, ENEPIG
Testing Methods Flying Probe Test (Free), AOI Test
Impedance Tolerance ±10%
Lead Time 2 – 28 days