Samsung SM471 Plus High-Speed SMT Mounter

Samsung SM471 Plus High-Speed SMT Mounter

Description

●The Samsung SM471 Plus is a high-speed SMT pick and place machine designed for fast, accurate, and stable component placement across modern PCB assembly environments. As an enhanced version of the SM471 platform, the SM471 Plus delivers increased throughput, improved motion control, and reliable placement accuracy, making it suitable for both high-volume production and high-mix manufacturing lines.

●Supporting a wide component range—from ultra-small chip components to medium-size IC packages—the SM471 Plus applies advanced vision alignment, flexible feeder configurations, and a stable mechanical structure to ensure consistent placement performance. It integrates smoothly into SMT production lines, helping manufacturers boost productivity, reduce defect rates, and maintain long-term operational stability in demanding electronics manufacturing workflows.

  • Brand: Samsung
  • Model: SM471 Plus
Category:

Outstanding Products Make You Stand Out

Each SMT pick and place machine is guaranteed to boost your PCB assembly business thanks to the number of qualities listed below.

  • ⚡Precise Placement: The accuracy of our SMT pick and place machines can achieve a level of precision that surpasses any human pick and place handling.
  • 🔥High Flexibility: All SMT pick and place machines are easy to program for various PCB boards with different dimensions, production requirements, and specifications.
  • 🧱Ease of Use: With the user-friendly aspect of our SMT pick and place machines, they can be incorporated into your production floor with the minimum training requirement.
  • 🧩Low Maintenance: The cutting-edge technology of our SMT pick and place machines requires minimal maintenance, helping you reduce cost while increasing productivity.

🔶 Samsung SM471 Plus Fast SMT Machine Specifications

Modal Name SM471PLus
Alignment Fly Camern
Number of Spindles 10 Spindles x2 Gantry
Placement Speed 78,000CPH(Optimum)
Placement
Accuracy		 chip ±40μm@μ±3σ
QFP ±50μm@μ±3σ
Component
Range		 Fly Camern chip
IC.Connector
BGA. CSP		 0402(01005)~□14mm IC
Connector
(Lead Pitch 0.4mm)
BGA,CSP
(Ball Pitch 0.4mm)
Fix Camen IC.Connectoe
BGA CSP		 _
MAX.Height 12mm
PCB Size(mm) Min 50(L)x 40(W)
Max single Lane 510(L)x460(W)
610(L)x460(W)(Option)
Dual Lane 460（L)x250(W)
610（L)x250(W)(Option)
PCB Thickness 0.38~4.2
Utility Power AC200/208/220/240/380/
415V (50/60Hz,3Phase)
Max. 5.0kVA
Air Consumption 0.5 -0.7MPa (5-7kgf/cm2)
350Nℓ/min
50Nℓ/min(vacuum pump)
Mass (kg) Approx. 1,820
External Dimension (mm) 1,650(L)x1,690(D)x1,485(H)

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