Samsung SM482 High-Speed SMT Chip Mounter
Samsung SM482 High-Speed SMT Chip Mounter - Image 2

Samsung SM482 High-Speed SMT Chip Mounter

Description
●The Samsung SM482 is a high-speed SMT placement machine engineered for fast, precise, and stable component mounting across modern PCB assembly lines. As part of Samsung’s proven SM4xx series, the SM482 offers enhanced placement accuracy, strong throughput, and reliable repeatability—making it suitable for both high-mix and high-volume SMT production environments. ●Supporting a wide component range from ultra-small chips to medium-size IC packages, the SM482 uses advanced vision alignment, optimized placement heads, and robust mechanical construction to maintain consistent production quality. Its flexible feeder compatibility, intelligent control functions, and smooth SMT line integration help manufacturers increase productivity, reduce defect rates, and ensure long-term manufacturing stability in demanding electronics applications.

Brand: Samsung
Model: SM482

Category:

Outstanding Products Make You Stand Out

Each SMT pick and place machine is guaranteed to boost your PCB assembly business thanks to the number of qualities listed below.

  • ⚡Precise Placement: The accuracy of our SMT pick and place machines can achieve a level of precision that surpasses any human pick and place handling.
  • 🔥High Flexibility: All SMT pick and place machines are easy to program for various PCB boards with different dimensions, production requirements, and specifications.
  • 🧱Ease of Use: With the user-friendly aspect of our SMT pick and place machines, they can be incorporated into your production floor with the minimum training requirement.
  • 🧩Low Maintenance: The cutting-edge technology of our SMT pick and place machines requires minimal maintenance, helping you reduce cost while increasing productivity.

🔶 Samsung SM482 SMT Assembly Machine Specifications

 

Model SM482
localization Flying Camera + Fixed Camera
Number of mounting shafts 6 Shaft rods x 1 cantilever
Mounting speed 28,000 CPH (optimal conditions)
Mounting Accuracy Chip/QFP ±50μm@μ±3σ/Chip,±30μm@μ±3σ/QFP
(based on standard components)
subassemblies Flight Camera FOV 16 (option) 0402(01005inch)~□14mmIC,Connector(pin pitch 0.4mm)
※ BGA,CSP(solder ball pitch 0.65mm)
FOV 25 (standard) 0603(0201inch)~□ 22mmIC,Connector
(pin spacing 0.5mm)~ □ 17mm
BGA, CSP(solder ball spacing 0.75mm)
Fixed camera FOV 35 (option) ~□32mm lC,Connector(pin spacing 0.3mm)
※BGA,CSP(solder ball spacing 0.5mm)~55mm(MFOV)
FOV 45 (standard) ~□42mmIC, Connector(Pin spacing 0.4mm)
※ BGA,CSP(Ball pitch 1.0mm)~□55mm(MFOV),~ □75mm Connector
maximum height 15mm
PCB size(mm) Min 50(L)x 40(W)
Max 460(L)x 400(W) 510(L)x460(W) (option)
610(L)x510(W) (option) 740(L)x460(W) (option)
PCB Thickness 0.38~4.2
Number of Feeder Slots 120ea/112ea (material truck)
Pneumatic and electric Power supply AC 200/208/220/240/380/415 V
(50/60Hz, 3Phase) Max.4.7kVA
Pneumatic pressure 0.5~0.7MPa(5~7kgf/cm2)180Nℓ/min,50Nℓ/min(Vacuum pump)
Equipment Weight Approx.1,600kg
Equipment size(mm) 1,650(L)x1,680(D)x 1,530(H)

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