V9-BTB Fully Automatic Vision Solder Paste Printer
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V9-BTB Fully Automatic Vision Solder Paste Printer

● User-friendly design
● Back-to-back configuration with single-station control
● Unique spray-type automatic cleaning system
● High-efficiency, energy-saving wiping and paper-saving mechanism
● Advanced image processing system
● Intelligent printing production mode
● Printing area: 510 × 310 mm
● Equipped with an industry-standard UVW three-axis linkage platform
● High precision, high speed, and high stability; ideal for smart wearables, mobile phones, and Mini LED production
● Machine dimensions: 1220 × 1355 × 1500 mm (single unit), 1220 × 2800 × 1500 mm (dual-unit configuration)
● Optional features: automatic solder addition, automatic stencil clog detection, automatic dispensing, squeegee pressure feedback, MSE/SPI inline connectivity, automatic temperature and humidity control

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Outstanding Products Make You Stand Out

Each SMT pick and place machine is guaranteed to boost your PCB assembly business thanks to the number of qualities listed below.

  • ⚡Precise Placement: The accuracy of our SMT pick and place machines can achieve a level of precision that surpasses any human pick and place handling.
  • 🔥High Flexibility: All SMT pick and place machines are easy to program for various PCB boards with different dimensions, production requirements, and specifications.
  • 🧱Ease of Use: With the user-friendly aspect of our SMT pick and place machines, they can be incorporated into your production floor with the minimum training requirement.
  • 🧩Low Maintenance: The cutting-edge technology of our SMT pick and place machines requires minimal maintenance, helping you reduce cost while increasing productivity.

🔶 V9-BTB Fully Automatic Vision Solder Paste Printer

Item Specification / Value
Model V9‑BTB
Screen Frame Size (Min) 470 × 370 mm
Screen Frame Size (Max) 737 × 550 mm / 737 × 650 mm
Screen Frame Thickness 25 – 40 mm
PCB Minimum Size 50 × 50 mm
PCB Maximum Size 510 × 310 mm
PCB Thickness 0.4 – 6 mm
PCB Warpage (Max) < 1%
Transport Height 900 ± 40 mm
Transport Direction Left‑Right; Right‑Left; Left‑Left; Right‑Right
Transport Speed (Max) 1500 mm/s (programmable)
Board Support System Magnetic pin / Adjustable up‑down table / Support block (manual adjust)
Clamping System Side clamping, vacuum nozzle, automatic telescopic Z‑axis pressure plate
Print Heads Two independent motorized print heads
Cleaning System Dry, Wet, Vacuum (programmable)
Table Adjustment Range X: ±10 mm; Y: ±10 mm; θ: ±2°
Solder Paste Inspection 2D Inspection (standard)
CCD FOV 10 × 8 mm
Fiducial Types Supported Square, Round, Triangle, Cross, Pad, Hole
Vision System / Camera CCD digital camera; geometry‑pattern matching; up & down optics structure
Operating Temperature -21 °C to +50 °C
Operating Humidity 30% – 60%
Power Input AC 220 V ±10%, 50/60 Hz, single phase, 3 kW
Control Method PC Control
Machine Dimensions 1220 (L) × 1355 (W) × 1500 (H) mm (single unit) / 1220 (L) × 2800 (W) × 1500 (H) mm (dual‑unit)
Machine Weight Approx. 1000 kg (single unit) / 2000 kg (dual‑unit)
Squeegee Type Stainless steel (standard), plastic squeegee (optional)
Substrate Separation Speed 0.1 – 20 mm/sec
Separation Option Separation after squeegee up; or squeegee up after separation; or keep squeegee on stencil (Area Separation / Line Separation)
Squeegee Speed 6 – 200 mm/sec
Squeegee Pressure 0 – 15 kg (motor controlled)
Squeegee Angle 60°, 55°, 45°
Repeat Position Accuracy ±0.01 mm (CPK ≥ 2.0)
Printing Accuracy ±0.025 mm (CPK ≥ 2.0)
Cycle Time < 7 s (excluding printing & cleaning)
Product Changeover Time < 5 min
Air Pressure Required 4.5 – 6 kg/cm²

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