SV-350 Precision Vacuum Defoaming System

The Vacuum Defoamer of VitaPCB is an industrial-grade device specially designed to solve the bubble problem in precision manufacturing. Through vacuum negative pressure and intelligent temperature control technology, it can quickly eliminate bubbles in adhesives, coatings, and packaging materials, improving product yield. It is applicable to fields such as optical adhesive bonding, electronic packaging, and medical devices, featuring high efficiency (3-5 minutes per batch), low energy consumption, and full automation.

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Outstanding Products Make You Stand Out

Each SMT pick and place machine is guaranteed to boost your PCB assembly business thanks to the number of qualities listed below.

  • Precise Placement: The accuracy of our SMT pick and place machines can achieve a level of precision that surpasses any human pick and place handling.
  • 🔥High Flexibility: All SMT pick and place machines are easy to program for various PCB boards with different dimensions, production requirements, and specifications.
  • 🧱Ease of Use: With the user-friendly aspect of our SMT pick and place machines, they can be incorporated into your production floor with the minimum training requirement.
  • 🧩Low Maintenance: The cutting-edge technology of our SMT pick and place machines requires minimal maintenance, helping you reduce cost while increasing productivity.

Equipment Features

  • Maximum PCB size 500mmX500mm;
  • Supports remote control, remote assistance, and custom model training ;
  • In-line design;
  • Adopting both vacuum and heating methods;
  • Resolution:400*300(12MP:100um,26MP:80um);500*500(12MP:125um,26MP:100um);
  • Optional:350°C high-temperature heating, nitrogen filling,visual Inspection, large-sized customization.

Technical parameters

Project SV-350
ControlSystem PCB board size 100*100mm-500*500mm
Thickness 0.5-2mm
camera 12MP/26MP color array high-speed industrial camera
Component Height Top Surface:50mm,Bottom Surface:50mm
Motion control Board+PCL
light source UV+W light source
movement speed max500mm/S
Testing related Application scope Bubble removal in processes such as dispensing and coating
Colloidal viscosity 20000cps以下
Below 20000pps
Vacuum pumping rate 60立方/h
Ultimate vacuum value 4Pa
Defoaming 40-300sec
Direction From left to right;Right to left;From left to left;Right to right;
software
system
Speed 0.5sec/FOV
Operating System Windows   10
Mixed board testing Mixed board production,supporting automatic program calling
Communication method Standard SMEMA interface
Data Output Automaticallygenerates Statistical Process Control(SPC)analysis
Industrial Control Host CPU:intel i7 Graphics card:Nvidia GTX Memory:32GB DDR4,Storage:256GB SSD+2TMechanical hard drive Network:1000M wired network card
Otherr Monitor 19 inch monitor
Sports organization Chain transmission
 Conveyor width adjustment 900±30mm optional automatic/manual
Dimension 1250*1400*1650mm,net weight:800KG
Power Supplyand Power AC220V 50HZ.rated power1.5KW