Discover our comprehensive PCB and PCBA manufacturing capabilities, including multilayer stackups up to 40 layers, 01005 component placement, high-precision drilling (±0.025mm), advanced copper weights up to 10oz, and a wide range of surface finishes. Equipped with 9 SMT lines, full inspection systems (SPI, AOI, X-ray), and support for HDI, rigid-flex, and high-frequency designs, we ensure exceptional quality from rapid prototyping to high-volume production.
Below is a detailed overview of our standard and advanced manufacturing capabilities—showcasing our commitment to precision, performance, and continuous innovation.
| PCB Capabilities | |
|---|---|
| Maximum layers | 40L |
| Maximum board thickness | 8.0mm |
| Minimum board thickness | 0.4mm |
| Maximum aspect ratio | 30:1 |
| Impedance tolerance | ±5Ω(＜50Ω), ±10%(≥50Ω); Min±8%(≥50Ω) |
| Board thickness tolerance | Thickness≤1.0mm; ±0.1mm Thickness＞1.0mm; ±10% |
| Maximum copper thickness | 10OZ |
| Minimum copper thickness | 1/2OZ |
| Thinnest 4-layer board | 0.33mm |
| Minimum mechanical hole/pad | 0.15/0.35mm |
| Drilling accuracy | ±0.025mm |
| Layer to layer accuracy | ≤3mil |
| Board thickness of Resin | 0.2-6.0mm |
| PTH hole tolerance | ±0.03mm |
| Minimum trace width/spacing | 0.065/0.065mm |
| HDI Structure | 1–7 Layer Arbitrary Interconnections |
| Bow and twist | Normal:0.75%, Min:0.5%, Max:2.0% |
| Lamination times | One core ≤5 times |
| Surface Finishes | ENIG, ENEPIG, OSP, HASL, Gold Plating (soft/hard), Immersion Silver, Immersion Tin, Bright Tin Plating, Silver Plating, Carbon Ink, HAL+gold finger |
| High-Speed / High-Frequency Materials | Supports Rogers, Taconic, Megtron, PTFE, Ceramic-Filled Materials, etc. |
| Support for | HDI, Blind & Buried vias, FPC flexible circuits, Heavy-copper boards, Rigid-Flex, Back-drilling, Hybrid Stackup, Metal Core PCBs, High Multilayer PCBs, High-Frequency PCBs, High-Speed PCBs |
| PCBA Capabilities | |
|---|---|
| Solder Type | Lead-free (RoHS Compliant) |
| Max PCB Size | 550*460*5mm |
| Min PCB Size | 50*50*0.8mm |
| Assembly Type | Surface Mount Technology (SMT) |
| Ball Grid Array (BGA) | |
| Mixed Technology (SMT and Through-Hole) | |
| Through-Hole Assembly | |
| Mixed Assembly | |
| Board Type | Rigid PCB, Flexible PCB, Metal Core PCB, Rigid-Flex PCB |
| Min BGA Pitch | 0.2mm |
| Max Component Size | 50*50*15mm |
| Assembly Sides | Single/Double Sided |
| Smallest Component Package | 01005/0402 |
| Quality Inspection | Visual Inspection |
| AOI (Automated Optical Inspection) | |
| X-RAY Inspection | |
| In-Circuit Test (ICT) | |
| Functional Test | |