Thick copper power PCB has gradually become a key component in the fields of industrial power supply, new energy vehicles, etc. with its excellent performance. It can not only carry large current and effectively solve the problem of equipment heat dissipation, but also greatly improve the stability and reliability of the system, providing a strong […]

As the core components of various high-end electronic devices, the quality and performance of multi-layer high-frequency PCB boards are directly related to the operating efficiency of the equipment. Manufacturers focusing on the production of multi-layer high-frequency PCB boards occupy an important position in the industry by virtue of their deep cultivation in technology, production and

HDI board: pursuit of superior integration and high performance (I) Core advantagesUltra-high wiring density: HDI board adopts blind hole and buried hole technology, breaking through the limitations of traditional wiring. For example, blind holes only extend to specific layers inside the circuit board, while buried holes are completely hidden inside the board, taking up no

High-density interconnect (HDI) PCBs with blind and buried vias have become an essential component in electronic product design due to their outstanding performance and compact layout. Through specialized via design, these PCBs not only achieve higher circuit density but also enhance signal integrity and circuit reliability. Optimizing the stack-up layers and via design is key