KNS HYbrid3/HYbrid5 Semiconductor Die Bonder
KNS HYbrid3/HYbrid5 Semiconductor Die Bonder - Image 2

KNS HYbrid3/HYbrid5 Semiconductor Die Bonder

Main Benefits

● Scalable Throughput: Passive placement speed up to 121,000 CPH (IPC9850); Flip Chip bonding up to 27,000 CPH.
● Accuracy: Flip Chip / Dies: 7 μm; Passive components: 15 μm.
● Cost of Ownership: Minimal maintenance cost; Lowest energy consumption; Passive and Die placement in a single pass.
● Scalable Technology: 100% active placement force control; Defect rates lower than 1 DPM; Supports tape, tray, waffle, wafer feeding, and dip fluxing; Full Die traceability (SECS/GEM, CAMX).
● Industry 4.0 Ready: IPC-Hermes-9852, IPC-CFX, SECS/GEM, CAMX.

  • Brand: KNS

  • Model: HYbrid3 / HYbrid5

Category:

Outstanding Products Make You Stand Out

Each SMT pick and place machine is guaranteed to boost your PCB assembly business thanks to the number of qualities listed below.

  • ⚡Precise Placement: The accuracy of our SMT pick and place machines can achieve a level of precision that surpasses any human pick and place handling.
  • 🔥High Flexibility: All SMT pick and place machines are easy to program for various PCB boards with different dimensions, production requirements, and specifications.
  • 🧱Ease of Use: With the user-friendly aspect of our SMT pick and place machines, they can be incorporated into your production floor with the minimum training requirement.
  • 🧩Low Maintenance: The cutting-edge technology of our SMT pick and place machines requires minimal maintenance, helping you reduce cost while increasing productivity.

🔶 KNS HYbrid3 Semiconductor Die Bonder Specifications

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