Panasonic NPM-D3

Panasonic NPM-D3

Description

● The Panasonic NPM-D3 is a high-speed modular SMT pick and place machine engineered to deliver exceptional throughput, advanced placement accuracy, and strong production scalability for modern PCB assembly lines.

● Designed as part of Panasonic’s next-generation NPM platform, the NPM-D3 supports ultra-fast component placement across a wide range—from micro-miniature 0201 metric parts to fine-pitch ICs, CSPs, BGAs, and large odd-form devices.

● Featuring dual laser recognition, multi-function placement heads, intelligent feeder logistics, and highly optimized motion control, the NPM-D3 offers superior cycle speed while maintaining precise and repeatable placement performance.

● Its modular architecture enables flexible line expansion, rapid product changeovers, and efficient feeder management—making it ideal for high-volume, high-precision SMT manufacturing environments requiring maximum productivity and long-term stability.

  • Brand: Panasonic
  • Model: NPM-D3
Category:

Outstanding Products Make You Stand Out

Each SMT pick and place machine is guaranteed to boost your PCB assembly business thanks to the number of qualities listed below.

  • ⚡Precise Placement: The accuracy of our SMT pick and place machines can achieve a level of precision that surpasses any human pick and place handling.
  • 🔥High Flexibility: All SMT pick and place machines are easy to program for various PCB boards with different dimensions, production requirements, and specifications.
  • 🧱Ease of Use: With the user-friendly aspect of our SMT pick and place machines, they can be incorporated into your production floor with the minimum training requirement.
  • 🧩Low Maintenance: The cutting-edge technology of our SMT pick and place machines requires minimal maintenance, helping you reduce cost while increasing productivity.

🔶 Panasonic NPM-D3 Pick and Place Machine Specifications

 

Model ID NPM-D3
Rear head Lightweight 12-nozzle head 8-nozzle head 2-nozzle head
Front head 16-nozzle head
Lightweight 16-nozzle head NM-EJM6D
12-nozzle head
8-nozzle head
2-nozzle head
PCB dimensions*1 (mm) Dual-lane mode L 50 x W 50 ~ L 510 x W 300
Single-lane mode L 50 x W 50 ~ L 510 x W 590
PCB exchange time Dual-lane mode 0 s* *No 0s when cycle time is 3.6 s or less
Single-lane mode 3.6 s* *When selecting short conveyors
Electric source 3-phase AC 200, 220, 380, 400, 420, 480 V 2.7 kVA
Pneumatic source*2 0.5 MPa, 100 L /min (A.N.R.)
Dimensions*2(mm) W 832 x D 2652*3x H 1444*4
Mass 1680 kg (Only for main body: This differs depending on the option configuration.)
Placement head Lightweight 16-nozzle head (Per head) 12-nozzle head (Per head) 8-nozzle head (Per head) 2-nozzle head (Per head)
High production mode [ON] High production mode [OFF]
Max. speed 42 000 cph (0.086 s/ chip) 38 000 cph (0.095 s/ chip) 34 500 cph (0.104 s/ chip) 21 500 cph (0.167 s/ chip) 5500 cph (0.655 s/ chip) 4250 cph (0.847 s/ QFP)
Placement accuracy (Cpk≧1) +/- 40 um/chip +/- 30 um / chip (+/- 25 um / chip*5) +/- 30 um / chip +/- 30 um/chip, +/- 30 um/QFP £12mm to £32mm +/- 50 um/QFP £ 12mm Under +/- 30 um/QFP
Component dimensions (mm) 0402 chip*6 to L6 x W6 x T3 03015*6*7/ 0402 chip*6 to L6 x W6 x T3 0402 chip*6 to L12 x W12 x T6.5 0402 chip*6 to L 32 x W 32 x T 12 0603 chip to L 100 x W 90 x T 28
Component supply Taping Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm Tape : 4 to 56 / 72 / 88 / 104 mm
Max. 68 (4, 8 mm tape, Small reel)
Stick – Max.16 (Single stick feeder)
Tray – Max.20 (per tray feeder)
Adhesive position accuracy(Cpk ≧ 1) +/- 75 umm /dot +/- 100 umm /component
Applicable components 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP SOP,PLCC,QFP, Connector, BGA, CSP
Inspection head 2D inspection head (A) 2D inspection head (B)
Resolution 18 um 9 um
View size (mm) 44.4 x 37.2 21.1 x 17.6
Inspection processing time Solder Inspection*9 0.35s/ View size
Component Inspection*9 0.5s/ View size
Inspection object Solder Inspection*9 Chip component : 100 um x 150 um or more (0603 mm or more); Package component : φ150 um or more Chip component : 80 um x 120 um or more (0402 mm or more); Package component : φ120 um or more
Component Inspection*9 Square chip (0603 mm or more), SOP, QFP (a pitch of 0.4 mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10 Square chip (0402 mm or more), SOP, QFP (a pitch of 0.3 mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10
Inspection items Solder Inspection*9 Oozing, blur, misalignment, abnormal shape, bridging
Component Inspection*9 Missing, shift, flipping, polarity, foreign object inspection*11
Inspection position accuracy*12 (Cpk ≧ 1) +/- 20 um +/- 10 um
No. of inspection Solder Inspection*9 Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)
Component Inspection*9 Max. 10 000 pcs./machine

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