Pillarhouse | Orissa Fusion
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Pillarhouse | Orissa Fusion

Description

High speed, in-line, multi-platform selective soldering system

Incorporating high speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offerings.
The standard four station cell can be configured to handle PCB’s up to 381mm x 460mm – fluxer, preheat, solder, solder. For high speed applications this same unit can be configured as fluxer/preheat and up to three solder modules with as many as five heater options.

An optional PCB transfer station and return conveyor enables product to be manually unloaded adjacent to the conveyor load station – this configuration reduces PCB handling capability to 381mm x 250mm.

Each solder cell can be configured with any of the currently available Pillarhouse solder technologies: custom-dip, multi-dip, Jet-Wave and single point AP down to the patented 1.5mm micro nozzle.

Easy, rapid non-contact solder pot changeover is facilitated via the optional heated pot exchange trolley.

  • Brand: Pillarhouse
  • Model: Orissa Fusion
Category:

Outstanding Products Make You Stand Out

Each SMT pick and place machine is guaranteed to boost your PCB assembly business thanks to the number of qualities listed below.

  • ⚡Precise Placement: The accuracy of our SMT pick and place machines can achieve a level of precision that surpasses any human pick and place handling.
  • 🔥High Flexibility: All SMT pick and place machines are easy to program for various PCB boards with different dimensions, production requirements, and specifications.
  • 🧱Ease of Use: With the user-friendly aspect of our SMT pick and place machines, they can be incorporated into your production floor with the minimum training requirement.
  • 🧩Low Maintenance: The cutting-edge technology of our SMT pick and place machines requires minimal maintenance, helping you reduce cost while increasing productivity.

🔶 Pillarhouse | Orissa Fusion, Selective Soldering System Specifications

Height 1390mm to 2045mm – with light stack
Width 2193mm Compact
2930mm Standard
Depth 1520mm

1740mmm with flux bottles
Board size 381mm x 460mm (Standard frame with 4 stations)
Larger PCB size available upon request
Edge clearance Above / below 3mm
Height clearance Above / below 40mm nominal, 70mm max
Solder Most commonly used solder types – including lead-free
Solder pot capacity 20kg standard – 30kg large bath
Applicators: AP style – 2.5 – 16mm dia.
Extended and Jet-Tip nozzles – up to 25mm dia.
Jet-Wave nozzles – up to 25mm width
Special dedicated nozzles available upon request
Flux Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
X, Y & Z Axis resolution 0.15mm

 
Repeatability +/- 0.05mm
Nitrogen usage 40 litres gas/min per bath using single bath with standard AP solder nozzle, 5 bar / 72 psi pressure.
Nitrogen purity 99.995% or better
Air supply pressure 5 bar / 72 psi
Power supplies Three-phase + neutral + PE
Voltage 230 V phase to neutral / 400V phase to phase
Frequency 50/60Hz
Power : Machine configuration dependent – contact your local Pillarhouse representative
Transport Motorized conveyor
Programming PillarCOMM Windows® based ‘Point & Click’ interface

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