TRI TR7007Q 3D

Description

The TRI TR7007Q 3D Solder Paste Inspection (SPI) Machine is a high-precision, online 3D SPI system designed for advanced PCB assembly. Equipped with 4 Mpix or 12 Mpix cameras and RGB true-color LED lighting, it uses digital fringe projection to deliver shadow-free, accurate solder paste measurements including height, area, volume, and offset. The system supports PCB sizes up to 510 × 460 mm, automatic warp compensation, and high-speed imaging, ensuring reliable detection of defects such as insufficient paste, bridging, or missing paste. Ideal for manufacturers seeking fast, precise, and fully automated solder paste inspection in modern SMT production lines.

  • Brand: TRI
  • Model: TR7007Q 3D
Category:

Outstanding Products Make You Stand Out

Each SMT pick and place machine is guaranteed to boost your PCB assembly business thanks to the number of qualities listed below.

  • Precise Placement: The accuracy of our SMT pick and place machines can achieve a level of precision that surpasses any human pick and place handling.
  • 🔥High Flexibility: All SMT pick and place machines are easy to program for various PCB boards with different dimensions, production requirements, and specifications.
  • 🧱Ease of Use: With the user-friendly aspect of our SMT pick and place machines, they can be incorporated into your production floor with the minimum training requirement.
  • 🧩Low Maintenance: The cutting-edge technology of our SMT pick and place machines requires minimal maintenance, helping you reduce cost while increasing productivity.

🔶 TRI TR7007Q 3D SMT SPI Machine Specifications

Product Name TRI TR7007Q 3D Solder Paste Inspection (SPI) Machine
Brand TRI (Taiwan)
Imaging Method Stop-and-Go Imaging
Camera 4 Mpix or 12 Mpix
Imaging Resolution 6 µm, 10 µm, 15 µm
Lighting RGB True Color LED
3D Technology 4-way Digital Fringe Pattern
Field of View (FOV) 4 Mpix + 10 µm: 20.3 × 20.3 mm
4 Mpix + 15 µm: 30.5 × 30.5 mm
12 Mpix + 6 µm: 24.4 × 18.4 mm
12 Mpix + 10 µm: 40.8 × 30.7 mm
12 Mpix + 15 µm: 61.2 × 46.1 mm
Imaging Speed 4 Mpix: 3 FOV/sec; 12 Mpix: 2–3 FOV/sec (CoaXPress option)
Height Resolution 6 µm: 0.22 µm; 10/15 µm: 0.4 µm
Max Solder Height 6 µm mode: 210/420 µm; 10/15 µm mode: 420/840 µm
Max PCB Size 510 × 460 mm (single lane); 510 × 310 mm × 2 lanes (DL)
PCB Thickness 0.6 – 5 mm
Max PCB Weight 3 kg
Clearances Top: 25 mm; Bottom: 40 mm; Edge: 3 mm
Conveyor Height 880 – 920 mm
Defect Detection Insufficient paste, Excessive paste, Shape deformity, Missing paste, Bridging
Measurements Height, Area, Volume, Offset
Features Shadow-free imaging, Auto warp compensation, SMEMA compatible, High speed & accuracy