TRI TR7700 SIII 3D

Description

● The TRI TR7700 SIII is a high-speed 3D AOI inspection system engineered for precise and reliable PCB quality control in SMT production lines.

● Equipped with advanced 3D measurement technology, multi-angle imaging, and high-resolution camera modules, the TR7700 SIII ensures accurate detection of solder defects, lifted leads, polarity errors, missing components, bridges, opens, and coplanarity issues.

● Designed for medium- to high-volume production environments, the system delivers fast inspection speeds without sacrificing accuracy.

● Its powerful image-processing algorithms, low false-call rate, and intuitive programming interface make it ideal for manufacturers demanding stable quality assurance and efficient inline inspection.

● With full MES connectivity and traceability support, the TR7700 SIII enhances process transparency and strengthens overall SMT production stability.

  • Brand: TRI
  • Model: TR7700SIII 3D
Category:

Outstanding Products Make You Stand Out

Each SMT pick and place machine is guaranteed to boost your PCB assembly business thanks to the number of qualities listed below.

  • Precise Placement: The accuracy of our SMT pick and place machines can achieve a level of precision that surpasses any human pick and place handling.
  • 🔥High Flexibility: All SMT pick and place machines are easy to program for various PCB boards with different dimensions, production requirements, and specifications.
  • 🧱Ease of Use: With the user-friendly aspect of our SMT pick and place machines, they can be incorporated into your production floor with the minimum training requirement.
  • 🧩Low Maintenance: The cutting-edge technology of our SMT pick and place machines requires minimal maintenance, helping you reduce cost while increasing productivity.

🔶 TRI TR7700 SIII – High-Speed 3D AOI Inspection System Machine parameters

 

Machine Model TR7700SIII 3D
Optical System
Imaging Method Dynamic Imaging with true 3D profile measurement
Top Camera 4 Mpix
Angle Camera N/A
Imaging Resolution 10 µm, 15 µm ( optional )
Lighting Multi-phase RGB+W LED
3D Technology Single/Dual 3D laser sensors
Max. 3D Range 20 mm
Inspection Performance
Imaging Speed 4 Mpix@ 10 µm 2D: 60 cm²/sec
4 Mpix@ 15 µm 2D: 120 cm²/sec
4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec*
4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec*
* Depending on board size and laser resolution
Motion Table & Control
X-Axis Control Ballscrew + AC-servo controller
Y-Axis Control Ballscrew + AC-servo controller
Z-Axis Control N/A
X-Y Axis Resolution 1 µm
Board Handling
Max PCB Size TR7700 SIII 3D: 510 x 460 mm
TR7700L SIII 3D: 660 x 460 mm
TR7700 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane
PCB Thickness 0.6-5 mm
Max PCB Weight 3 kg
Top Clearance 25 mm
Bottom Clearance 40 mm
Edge Clearance 3 mm ( 5 mm optional )
Conveyor Inline
Height: 880 – 920 mm
* SMEMA Compatible
Inspection Functions
Component Missing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective
Upside Down
Extra Component
Foreign Material
Lifted Component
Solder Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger
Scratch/Contamination
Dimensions
WxDxH TR7700 SIII 3D: 1100 x 1670 x 1550 mm
TR7700L SIII 3D: 1300 x 1630 x 1655 mm
TR7700 SIII 3D DL: 1100 x 1770 x 1550 mm
Note: not including signal tower, signal tower height 520 mm
Weight TR7700 SIII 3D: 1030 kg
TR7700L SIII 3D: 1250 kg
TR7700 SIII 3D DL: 1150 kg