TRI TR7007 SII 3D

TRI TR7007 SII 3D

Description

● The TRI TR7007 SII 3D Solder Paste Inspection Machine (SPI) provides high-speed, high-accuracy inspection for solder paste printing quality in SMT production lines.

● Featuring 3D laser measurement technology, high-resolution cameras, and intelligent defect detection algorithms, the TR7007 SII ensures precise inspection of paste height, volume, area, and position in real time.

● Its inline SMEMA-compatible design allows seamless integration with screen printers and placement machines, improving process control and reducing rework.

● With advanced SPC analysis and traceability support, it is ideal for high-mix and high-volume electronics manufacturing.

● Fully CE and RoHS compliant, the TR7007 SII delivers stable, repeatable performance for modern SMT environments.

  • Brand: TRI
  • Model: TR7007 SII 3D
Category:

Outstanding Products Make You Stand Out

Each SMT pick and place machine is guaranteed to boost your PCB assembly business thanks to the number of qualities listed below.

  • ⚡Precise Placement: The accuracy of our SMT pick and place machines can achieve a level of precision that surpasses any human pick and place handling.
  • 🔥High Flexibility: All SMT pick and place machines are easy to program for various PCB boards with different dimensions, production requirements, and specifications.
  • 🧱Ease of Use: With the user-friendly aspect of our SMT pick and place machines, they can be incorporated into your production floor with the minimum training requirement.
  • 🧩Low Maintenance: The cutting-edge technology of our SMT pick and place machines requires minimal maintenance, helping you reduce cost while increasing productivity.

🔶 TRI TR7007 SII SMT SPI Machine Specifications

 

Model TRI TR7007 SII 3D
Optical System
Imaging Method Dynamic Imaging
Camera 4 Mpix
Imaging Resolution 10 µm or 15 µm (factory setting)
Lighting RGB LED
3D Technology 2-way Fringe Pattern
Field of View 4 Mpix@ 10 µm: 20 x 20 mm
4 Mpix@ 15 µm: 30 x 30 mm
Inspection Performance
Imaging Speed 4 Mpix@ 10 µm: 80 cm²/sec
4 Mpix@ 15 µm: 180 cm²/sec
Height Resolution 0.4 µm
Max. Solder Height @ 10 µm: 600 µm
@ 15 µm: 550 µm
Motion Table & Control
X-Axis Control Linear Motor and linear scale with DSP-based controller
Y-Axis Control Ballscrew + AC-servo controller
Z-Axis Control Ballscrew + AC-servo controller
X-Y Axis Resolution 0.5 µm
Z-Axis Resolution 1 µm
Board Handling
Max PCB Size TR7007 SII: 510 x 460 mm
TR7007LL SII: 850 x 610 mm
PCB Thickness 0.6-5 mm
Max PCB Weight TR7007 SII: 3 kg
TR7007LL SII: 5 kg
Top Clearance 40 mm
Bottom Clearance 40 mm
Edge Clearance 3 mm
Conveyor Height 880 – 920 mm
* SMEMA Compatible
Inspection Functions
Defects Insufficient Paste
Excessive Paste
Shape Deformity
Missing Paste & Bridging
Measurement Height
Area
Volume
Offset
Dimensions
WxDxH 1220 x 1663 x 1620
Note: not including signal
tower, signal tower height 520 mm
Weight 920 kg

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